{"id":6239,"date":"2026-04-02T08:05:10","date_gmt":"2026-04-02T08:05:10","guid":{"rendered":"https:\/\/wiresawcutter.com\/?p=6239"},"modified":"2026-04-02T08:25:52","modified_gmt":"2026-04-02T08:25:52","slug":"semiconductor-multi-wire-saw","status":"publish","type":"post","link":"https:\/\/wiresawcutter.com\/nl\/blog\/semiconductor-multi-wire-saw\/","title":{"rendered":"Semiconductor Multi Wire Saw: Working Principle, Specs, and Selection Guide"},"content":{"rendered":"

How Semiconductor Multi Wire Saws Slice Wafers: Principle, Specifications, and Buying Guide<\/strong><\/p>\n

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\ud83d\udcd0 Quick Specs \u2014 Semiconductor Multi Wire Saw<\/strong><\/p>\n\n\n\n\n\n\n\n\n
Wire Count<\/strong><\/td>\n500\u20132,000 parallel wires per run<\/td>\n<\/tr>\n
Wire Speed<\/strong><\/td>\n10\u201325 m\/s<\/td>\n<\/tr>\n
Wafer Output<\/strong><\/td>\n300+ slices per single cut cycle<\/td>\n<\/tr>\n
Kerf Loss<\/strong><\/td>\n150\u2013250 \u00b5m (standard diamond wire)<\/td>\n<\/tr>\n
TTV<\/strong><\/td>\n<10 \u00b5m standard, <5 \u00b5m achievable<\/td>\n<\/tr>\n
Materials<\/strong><\/td>\nSi, SiC, sapphire, GaAs, GaN, quartz, ceramics, graphite<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n

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What Is a Semiconductor Multi Wire Saw and How Does It Work?<\/h2>\n

\"What<\/p>\n

A semiconductor multi wire saw is a precision machine, working on hundreds of parallel thin wires stretched across a set of grooved guide rollers to simultaneously slice a single ingot into a multitude of wafers. A multi-wire saw differs from a single-wire saw \u2014 which produces 1 wafer at a time \u2014 a multi-wire saw can contain between 500-2000 wire spans in a single wire web, producing 300 or more slices per cycle.<\/p>\n

How a multi-wire saw works is simple. A continuous wire (diamond coated or bare wire fed with abrasive slurry) is looped around one or more wire guide rollers, forming a parallel “web” of sawing wires across the workpiece. The ingot is held down onto the wire web by a feed table utilizing an epoxy adhesive to securely mount it. Feed rate is controlled, and as the wire web proceeds at rates between 10-25 metres per second, the wire abrasively wears its way through the workpiece to produce wafers with uniform characteristics, and little wasted material.<\/p>\n

Five core components define the machine architecture:<\/p>\n