DONGHE

Our editorial content covers diamond wire cutting of hard materials and the production steps around it. A site article presents a sapphire substrate route from ingot to wafer. We aim to explain the process questions a buyer should raise, including workpiece size, cut quality, equipment fit, and downstream handling.

Joined: January 20, 2026
Articles: 1

Company News

12-Inch Sapphire Substrate Cutting Made Easier Donghe Technology’s Complete Diamond Wire Cutting Solution Connects the Entire Process from Ingot to Wafer

ith the continuous development of GaN devices, optoelectronic devices, and semiconductor substrate applications, sapphire substrates are moving rapidly toward larger sizes, higher material utilization, and greater consistency. When yield remains comparable, larger sapphire crystals can improve material utilization and enhance…

DONGHE
May 13, 2026