MW2318 Multi-Wire Cutting Machine

Application Fields

Optical Materials

• Glass
• Crystals

Acoustic Materials

• Piezoelectric Ceramics
• Piezoelectric Crystals

Photovoltaic/Semiconductor Materials

• Monocrystalline Silicon
• Polycrystalline Silicon
• Silicon Carbide

Other Materials

• Oxide Crystals
• Ceramic Materials (Silicon Nitride, Boron Carbide)
• Aluminum Oxide
• Zirconium Oxide

Main Functions

This equipment is primarily used for cutting various hard and brittle materials including monocrystalline silicon, polycrystalline silicon, silicon carbide, ceramics, and magnetic materials. Through high-precision cutting, it improves work efficiency and reduces material loss.

Maximum Workpiece Cutting Size: 230mm × 250mm × 180mm

Machine Weight: 7,500 kg

Key Features

• Robust Construction: Machine body adopts cast and forged components for excellent stability
• Precision Control: Equipped with internationally renowned servo drivers for high control accuracy and fast response speed
• High-Efficiency Cutting: Cutting speed up to 2,500 m/min
• User-Friendly: Humanized operation interface, intelligent and convenient
• Durable Finish: Equipment surface treated with imported paint, no peeling or fading
• Versatile Design: Feed worktable with ±6° rocking design, suitable for ultra-hard and brittle material processing