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Minimizing Subsurface Damage in Crystal Sawing

Best Practices for Preventing Subsurface Damage in Crystal Sawing

The demand for near-perfect microwires in the field of crystals, including semiconductor, optics, or photovoltaic, would require accuracy in cutting the crystal. Even a small defect beneath the surface, caused during cutting, can affect these costly components’ strength and operation.…

SiC Crystal Wire Saw Cutting Complete Guide

Introduction to SiC Wire Saw Cutting

Considering their outstanding features, such as high resistance to wear, excellent heat dissipation, and resistance to chemical reactions, silicon carbide (SiC) crystals are on the cutting edge of modern materials because of these properties. Nonetheless, because of the very nature…

Silicon Wafer Cutting Guide

Advantages of Wire Saw Cutting for Semiconductor Manufacturing

One of the most important processes during the production of semiconductors is the silicon wafer slicing. In this process, highly accurate operations are required, allowing the operator to achieve better results with minimal deviation from the perfect result. The purpose…

Types of Crystal Wire Saws Explained

Classification Based on Cutting Mechanism

Precision cutters, such as crystal wire saws, are handy tools used in industries where exact cuts are required — electronics, PV, and advanced materials. These machines can cut a variety of crystalline materials like silicon, sapphire, and quartz. Nevertheless, similar…